1. Current status and driving force of the development of the optical module industry
As the core component of the optical communication system, the optical module undertakes the key function of photoelectric signal conversion. Its development directly benefits from the explosive demand in fields such as 5G, cloud computing, AI computing power and data centers. According to industry reports, the global optical module market size is expected to grow from US$11 billion in 2022 to more than US$20 billion in 2027, with an annual compound growth rate of more than 10%. As one of the world's largest consumer markets, China's market size has reached US$4-5 billion in 2022, and the growth rate in the next five years may reach more than 15%, far exceeding the global average.
Core driving force:
Surge in computing power demand: AI large model training and reasoning put forward higher requirements for high-speed data transmission, promoting the accelerated implementation of ultra-high-speed modules such as 800G and 1.6T.
Data center expansion: Global ultra-large-scale data center construction (such as the "East Data West Computing" project) drives the demand for high-density, low-power optical modules.
5G network deepening: 5G base station fronthaul/midhaul/backhaul networks rely on high-bandwidth, low-latency optical modules.
Silicon photonics technology breakthrough: Silicon photonics technology has become the core direction of the next generation of optical modules through its integration and low-cost advantages.
2. Mainstream optical module models and application scenarios
Optical module models are divided according to speed, packaging, transmission distance and other dimensions, and different specifications are adapted to diverse scenario requirements:
1. Divided by speed
100G/200G module:
Application scenarios: 5G base station midhaul/backhaul, metropolitan area network, enterprise-level data center interconnection.
Technical features: Supports 10-80km transmission, adopts QSFP28 packaging, is compatible with CWDM/DWDM technology, and meets medium bandwidth requirements.
Representative models: 100G QSFP28 LR4 (10km), 100G QSFP28 ER4 (40km).
400G module:
Application scenarios: internal interconnection of large data centers (such as leaf-spine architecture), short-distance transmission of AI training clusters.
Technical features: mostly using QSFP-DD or OSFP packaging, supporting single-mode/multi-mode optical fiber, power consumption less than 9W (silicon photonics solutions have significant advantages).
Representative models: 400G QSFP-DD DR4 (500m), 400G OSFP LR8 (10km).
800G module:
Application scenarios: AI computing center GPU interconnection, ultra-large-scale data center backbone network.
Technical features: silicon photonics technology-dominated, integrated single-wave 200G chip, supports LPO (linear direct drive) technology to reduce power consumption, and adapts to CPO (co-package) architecture.
Representative models: 800G OSFP DR8 (500m), 800G OSFP 2×FR4 (2km).
1.6T/3.2T module (future trend):
Application scenarios: next-generation AI computing clusters, ultra-long-distance interconnection (DCI) between data centers.
Technical features: Silicon photonics combined with thin-film lithium niobate modulation technology, supports single-wavelength rates of more than 200G, compatible with CPO and LPO solutions, and is expected to be commercially available on a large scale after 2026.
2. Classification by package type
SFP/SFP+: Adapts to rates below 10G and is widely used in the access layer of enterprise networks.
QSFP/QSFP28: Focuses on the 40G/100G market and is suitable for connections within data center racks.
QSFP-DD/OSFP: Supports 400G/800G high rates, meets high-density wiring requirements, and is the mainstream solution for AI data centers.
3. Classification by transmission mode
Multimode module (850nm wavelength): short-distance (<2km) scenarios, such as interconnection between computer rooms in data centers.
Single-mode module (1310/1550nm wavelength): long-distance (10-200km) scenarios, such as telecommunications backbone networks and cross-data center transmission.
III. Future technology trends and challenges
Technology evolution direction:
Silicon photonic integration: Intel, Zhongji Xuchuan and other manufacturers have mass-produced 800G silicon photonic modules, and 1.6T chips have entered the verification stage.
Intelligent management: integrated self-diagnosis and fault warning functions to improve network operation and maintenance efficiency.
Low power design: LPO technology can reduce power consumption by 30%, and the CPO solution further reduces electrical signal loss.
Industry challenges:
Chip localization: High-speed optical chips above 25G still rely on imports, and domestic companies such as Optical Components and Yuanjie Technology are accelerating breakthroughs.
Standard unification: The packaging and interface protocols of 800G/1.6T modules require global collaboration.
IV. Conclusion
The optical module industry is in the dual waves of "speed revolution" and "technology iteration". In the short term, 800G modules will dominate AI computing infrastructure; in the medium and long term, 1.6T and above models, silicon photonics and CPO technology integration will become the commanding heights. With the advantages of cost and response speed, Chinese companies are expected to further expand their share in the high-speed market, but they need to continue to break through the bottleneck of core technology to cope with international competition.
References: industry reports, technical white papers, market analysis.